US Patent 9318251 Method of manufacturing an electronic component

A method of manufacturing an electronic component including providing a wire having first and second ends and a pre-formed core, winding the wire about at least a portion of the pre-formed core and connecting the first and second wire ends to at least one terminal for mounting the component to a circuit, and using a wet press process to form a mixture of magnetic and/or non-magnetic material over at least a portion of the wire and pre-formed core, and harden the mixture without exposing the wire and pre-formed core to the damaging forces of a dry press process to form an electronic component with a generally planar top surface with which the component can be picked and placed on a circuit using conventional pick-and-place equipment.