Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 19, 2016
Patent Application Number
14578695
Date Filed
December 22, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.
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