US Patent 9319799 Microphone package with integrated substrate
Patent 9319799 was granted and assigned to Bosch on April, 2016 by the United States Patent and Trademark Office.
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Patent abstract
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described.
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Patent Inventor Names
Jay Salmon0
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US Patent 09319799 Microphone package with integrated substrate US Patent 9319799 Microphone package with integrated substrate
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Patent Number
093197990
Patent Number
93197990
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Official Website
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Katrina-Kay Pettitt
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Current Assignee
Patent Applicant
Current Assignee
Patent Applicant
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Patent Applicant
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Patent Jurisdiction
Patent Number
093197990
Date of Patent
April 19, 2016
0Patent Application Number
139713820
Date Filed
August 20, 2013
0Official Website
Patent Primary Examiner
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US Patent 09319799 Microphone package with integrated substrate
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09319799
Date of patent
April 19, 2016
Patent application number
13971382
Date Filed
August 20, 2013
Patent primary examiner
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