Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Li Li0
Lin Shen0
Subbarao Arumilli0
Date of Patent
May 10, 2016
Patent Application Number
13588544
Date Filed
August 17, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A Multi-Chip Module is presented herein that comprises a package substrate, at least two integrated circuit devices, each of which is electrically coupled to the package substrate, and an interposer. Formed in the interposer are electrical connections which are predominantly horizontal interconnects. The first interposer is arranged to electrically couple the two integrated circuit devices to each other. Methods for manufacturing a Multi-Chip Module are also presented herein.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.