Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jing-Chen Lin0
Ku-Feng Yang0
Yung-Chi Lin0
Date of Patent
May 17, 2016
0Patent Application Number
136911780
Date Filed
November 30, 2012
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A device includes a semiconductor substrate having a front surface and a back surface opposite the front surface. An insulation region extends from the front surface into the semiconductor substrate. An inter-layer dielectric (ILD) is over the insulation region. A landing pad extends from a top surface of the ILD into the insulation region. A through-substrate via (TSV) extends from the back surface of the semiconductor substrate to the landing pad.
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