Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 17, 2016
Patent Application Number
13787465
Date Filed
March 6, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a second metal pillar is formed overlying a passivation layer in a second region of the first substrate. A first solder joint region is formed between metal pillar and the first connector, and a second solder joint region is formed between the second metal pillar and the second connector. The lateral dimension of the first metal pillar is greater than the lateral dimension of the second metal pillar.
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