US Patent 9346991 Thermal interface materials and systems and devices containing the same

Patent 9346991 was granted and assigned to Ada Technologies, Inc. on May, 2016 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Ada Technologies, Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

93469910

Patent Inventor Names

Douglas Campbell0

Sayangdev Naha0

Steven C. Arzberger0

Date of Patent

May 24, 2016

Patent Application Number

134482570

Date Filed

April 16, 2012

Patent Citations Received

‌

US Patent 11933549 Nanowire-based thermal interface

Patent Primary Examiner

‌

Mark Kopec

Patent abstract

This disclosure relates generally to thermally conductive polymer composites and particularly to thermal interface materials.

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