Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Date of Patent
May 24, 2016
Patent Application Number
14148585
Date Filed
January 6, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor module comprises a wafer package comprising an integrated circuit (IC) device embedded within the wafer package and a layer comprising at least one antenna structure and redistribution structures, wherein the antenna structure is coupled to the IC device and wherein the redistribution structures are coupled to the IC device.
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