Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Azusa Yanagisawa0
Date of Patent
May 31, 2016
0Patent Application Number
145415370
Date Filed
November 14, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device according to the present invention includes: a combination object; and a chip having a front surface opposed to a front surface of the combination object. The chip includes: a multi-level wiring structure provided in the front surface of the chip; a connection electrode provided in the multi-level wiring structure and electrically connected to the combination object; an alignment mark set provided in the multi-level wiring structure and electrically isolated from the connection electrode; and an electrically conductive film provided at a higher level than the alignment mark set in association with the multi-level wiring structure to cover the alignment mark set and electrically isolated from the connection electrode.
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