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US Patent 9355936 Flattened substrate surface for substrate bonding
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Patent
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Date Filed
April 1, 2014
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Date of Patent
May 31, 2016
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Patent Application Number
14242203
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Patent Citations Received
US Patent 11855246 Semiconductor device and method
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US Patent 11961800 Via for semiconductor device connection and methods of forming the same
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US Patent 12132029 Integrating passive devices in package structures
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Patent Inventor Names
Leathen Shi
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Cornelia K. Tsang
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BethAnn Rainey Lawrence
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Charles S. Musante
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Dale W. Martin
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Edmund J. Sprogis
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Edward C. Cooney, III
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James S. Dunn
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9355936
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Patent Primary Examiner
Amar Movva
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