Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Moon Il Kim0
Yong Soon Jang0
Sang Min Lee0
Date of Patent
May 31, 2016
0Patent Application Number
144609090
Date Filed
August 15, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A package substrate includes an insulating layer; and circuit patterns formed on the insulating layer and divided into pad areas and pattern areas that have different heights. In one aspect, there can be a non-conductive paste (NCP) interposed between the circuit patterns and pads of a die connected to the circuit patterns to fix the die onto the insulating layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
