Patent attributes
The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.
