Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 21, 2016
Patent Application Number
14197280
Date Filed
March 5, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.
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