Patent attributes
In an example embodiment, an apparatus includes an enclosure having a loudspeaker mounted therein. The apparatus also includes an IC package mounted inside the enclosure. The IC package includes an amplifier configured to amplify an input audio signal, received at an input of the amplifier, to produce a drive signal. The amplifier is configured to drive the loudspeaker with the drive signal via an output of the amplifier. The IC package also includes a pressure sensor configured to output a status signal, indicative of a sound pressure level inside the enclosure, from an output terminal of the pressure sensor. The apparatus also includes an audio processing circuit connected to the amplifier and configured to adjust strength of the drive signal produced by the amplifier, as a function of the sound pressure level indicated by the status signal.
