Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 5, 2016
Patent Application Number
14249637
Date Filed
April 10, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
Disclosed herein is a method of forming a device, comprising mounting a plurality of first interconnects on one or more first integrated circuit dies. One or more second integrated circuit dies are mounted on a first side of an interposer. The interposer is mounted to at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer. The interposer is mounted to a first side of a substrate by attaching the first interconnects to the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects.
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