Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jong-joo Lee0
Date of Patent
July 12, 2016
Patent Application Number
14201756
Date Filed
March 7, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package, comprising: a substrate; a first semiconductor chip; and at least one second semiconductor chip. The first semiconductor chip and the at least one second semiconductor chip are stacked on the substrate; the first semiconductor chip is electrically connected with the substrate; and an electrical connection of each second semiconductor chip is formed through a secondary input/output buffer of the first semiconductor chip.
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