Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Charles G. Woychik0
Arkalgud Sitaram0
Hong Shen0
Zhuowen Sun0
Date of Patent
July 26, 2016
0Patent Application Number
142757410
Date Filed
May 12, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A combined interposer (120) includes multiple constituent interposers (120.i), each with its own substrate (120.iS) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer (120R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer (120R.B). The constituent interposer substrates (120.iS) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided.
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