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US Patent 9406658 Embedded component device and manufacturing methods thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 17, 2010
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Date of Patent
August 2, 2016
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Patent Application Number
12972046
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Patent Citations Received
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US Patent 12087700 Embedded die microelectronic device with molded component
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US Patent 11749610 Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip
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US Patent 11764311 Optical device and electronic device
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US Patent 11844178 Electronic component
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US Patent 11882660 Embedded component package structure and manufacturing method thereof
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US Patent 11894306 Chip package
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US Patent 12027481 Device including semiconductor chips and method for producing such device
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US Patent 12062618 Chip package
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US Patent 11749576 Stacked circuit package with molded base having laser drilled openings for upper package
Patent Inventor Names
Yuan-Chang Su
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Shih-Fu Huang
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Chun-Che Lee
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Ming Chiang Lee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9406658
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Patent Primary Examiner
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Mohammad Islam
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