US Patent 9412612 Method of forming semiconductor device

A method of forming a semiconductor device is disclosed. A substrate having a first area and a second area is provided. A target layer and a hard mask layer are sequentially formed on the substrate in the first area and in the second area. Transfer patterns are formed in a spacer form on the hard mask layer in the first area. A photoresist layer is formed directly on the hard mask layer, and covers the transfer patterns and the hard mask layer in the first area and in the second area. The photoresist layer in the first area is removed. The hard mask layer is patterned by using the transfer patterns as a mask.