US Patent 9425174 Integrated circuit package with solderless interconnection structure
Patent 9425174 was granted and assigned to Altera on August, 2016 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 18, 2014
Date of Patent
August 23, 2016
Patent Applicant
Patent Application Number
14546296
Patent Inventor Names
Loon Kwang Tan
0
Chew Ching Lim
0
Tze Yang Hin
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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