US Patent 9433081 Differential signal crosstalk minimization for dual stripline

The subject technology provides configurations for a printed circuit board that includes a first reference plane, a first signal layer below the first reference plane, a second signal layer below the first signal layer, a second reference plane below the second signal layer, a first differential pair on the first signal layer, and a second differential pair on the second signal layer, each of the first and second differential pairs comprising, respectively, a first pair and a second pair of conductive traces formed on a dielectric material of the PCB, the first pair of conductive traces being arranged on the dielectric material to interleave with the second pair of conductive traces.