US Patent 9435477 Creating thermal uniformity in heated piping and weldment systems

A piping system comprises a resistive heating circuit, a target heating surface, and a thermally conductive substrate adjoin (or abutting) both the heating circuit and the heating surface. The thermally conductive substrate can be composed of aluminum or some other material for heat spreading. A material for heat spreading has a thermal conductivity sufficient to evenly heat a section of the target surface within tolerance requirements of a sensitive application. The even heating can eliminate hot spots and cold spots of a temperature gradient along an axis of the piping system.