Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 13, 2016
Patent Application Number
13619877
Date Filed
September 14, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A system and method for stacking semiconductor devices in three dimensions is provided. In an embodiment two or more semiconductor dies are attached to a carrier and encapsulated. Connections of the two or more semiconductor dies are exposed, and the two or more semiconductor dies may be thinned to form connections on an opposite side. Additional semiconductor dies may then be placed in either an offset or overhanging position.
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