Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jong Sik Paek0
No Sun Park0
Date of Patent
October 11, 2016
Patent Application Number
14815435
Date Filed
July 31, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.
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