Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 11, 2016
Patent Application Number
14478810
Date Filed
September 5, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible processor substrate. In some arrangements, a thermally insulating stiffener can be disposed between the sensor substrate and the flexible processor substrate. At least one end portion of the flexible processor substrate can be bent around an edge of the stiffener to electrically couple to the sensor substrate
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