A photoelectric conversion module includes a circuit board, a flexible substrate configured on the circuit board, with a concave structure having a first optical micro-reflection surface and a second optical micro-reflection surface formed opposite to the first optical micro-reflection surface, an optical component configured on the flexible substrate, an IC chip mounted on the circuit board and electrically connected to the optical component via a wire and a conductive trace on the flexible substrate, and an optical waveguide member connected to the flexible substrate. The flexible substrate and the optical waveguide member are packaged by a carrier or an optical connector.