Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rodney D. Cameron0
Peter T. Heisen0
Jimmy S. Takeuchi0
Date of Patent
October 18, 2016
0Patent Application Number
137574510
Date Filed
February 1, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method includes coupling a printed circuit board (PCB) and a first conductive sheet to a pressure plate to form an antenna sub-assembly. The first conductive sheet defines a first plurality of openings and includes a first plurality of bumps. At least one opening of the first plurality of openings is surrounded by a set of bumps of the first plurality of bumps. The method includes coupling the antenna sub-assembly to a cover to form an antenna assembly.
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