Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chia-Ho Chen0
Shin-Puu Jeng0
Wen-Chih Chiou0
Weng-Jin Wu0
Chen-Hua Yu0
Chen-Yu Tsai0
Chien-Ming Chiu0
Fang Wen Tsai0
...
Date of Patent
October 25, 2016
0Patent Application Number
145423170
Date Filed
November 14, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
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