Patent attributes
A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.
