Patent attributes
A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component 102 and the terminal assembly 10 mounted on the one principal surface of the wiring substrate 101, with a first resin layer 103. Also, since the plurality of connection terminals 11 are merely supported by the support body 12, the support body 12 can be easily removed from the plurality of connection terminals 11. Accordingly, the manufacturing time of the module 100 is decreased.
