Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 22, 2016
Patent Application Number
12705846
Date Filed
February 15, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A multiple-chip-package (MCP) has multiple chip groups and multiple package terminal groups for electrical connections in the MCP. Semiconductor chips of the same chip group are electrically connected to the package terminals of the same package terminal group, while package terminals of different chip groups are electrically connected to the package terminals of different package terminal groups.
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