US Patent 9543242 Semiconductor package and fabricating method thereof
Patent 9543242 was granted and assigned to Amkor Technology on January, 2017 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 11, 2015
0
Date of Patent
January 10, 2017
0
Patent Applicant
Patent Application Number
14823689
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Patent Citations Received
Patent Inventor Names
David Hiner
0
Michael Kelly
0
Roger St. Amand
0
Ronald Huemoeller
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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