Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 21, 2017
Patent Application Number
12941074
Date Filed
November 7, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method to form a 3D integrated circuit, the method including: fabricating two or more devices; connecting the devices together to form the 3D integrated circuit, where at least one of the devices has at least one unused designated dice line and at least one of the devices is a configurable device; and interconnecting at least two of the devices using Through Silicon Vias.
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