Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasuo Yokoyama0
Tetsuya Kitaichi0
Date of Patent
February 28, 2017
0Patent Application Number
139403730
Date Filed
July 12, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A resin-sealed module is provided which reduces the warpage of a substrate and the detachment between a sealing resin and the substrate which occur during re-reflow, has the excellent flatness of the top and bottom surfaces, and reduces the occurrence of the short failures. A resin layer made of a thermoplastic resin is arranged on top of a substrate, and a resin layer made of a thermosetting resin is arranged on top of this resin layer, thereby reducing the warpage of the substrate and the detachment between the sealing resin and the substrate which occur during re-reflow.
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