Patent attributes
Embodiments of the invention include devices, systems and methods for using or manufacturing a camera enclosure or mobile device that includes a thermally conductive camera module, such as having a minimum thermal conductivity of 200 watts per meter Kelvin (W/mK), that enhances heat transfer between a stiffener and cap of the enclosure. This allows heat produced by the camera to be conducted forward, away from the bottom of the stiffener, through the stiffener, and to the top of can so that the bottom of the stiffener does not heat to a high temperature, components of the device or an outer surface of a cover of the device near the bottom of the stiffener. This substantially increases the time before or avoids having the temperature of outer surface reach a high temperature, such as one that will be uncomfortable to the user. Other embodiments are also described and claimed.
