Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 21, 2017
Patent Application Number
14804261
Date Filed
July 20, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
Vertically stacked system in package structures are described. In an embodiment, a package includes a first level molding and fan out structure, a third level molding and fan out structure, and a second level molding and fan out structure between the first and third levels. The second level molding and fan out structure includes back-to-back facing die, with a front surface of each die bonded to a redistribution layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
