Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Keita Takada0
Noriko Okunishi0
Yuichi Yato0
Hiroi Oka0
Date of Patent
March 28, 2017
0Patent Application Number
149014240
Date Filed
July 5, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.
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