US Patent 9627318 Interconnect structure with footing region
Patent 9627318 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2017 by the United States Patent and Trademark Office.
All edits
In some embodiments, an interconnect structure includes a base layer, a plurality of dielectric layers and a conductive structure. The base layer includes a conductive region. The plurality of dielectric layers are formed over the base layer. The plurality of dielectric layers includes a first dielectric layer and an etch stop layer under the first dielectric layer. The conductive structure includes a plug. The plug includes a central region and one or more footing regions. The footing regions are formed around the central region and formed at least partially in the first etch stop layer. A total width of the central region and one or more footing regions at a bottom level of the plurality of dielectric layers is at least about 5% more than a width of the central region at the bottom level of the plurality of dielectric layers.
US Patent 09627318 Interconnect structure with footing region US Patent 9627318 Interconnect structure with footing region
US Patent 09627318 Interconnect structure with footing region
Find more entities like US Patent 9627318 Interconnect structure with footing region
