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US Patent 9627346 Underfill pattern with gap
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Patent
Date Filed
December 11, 2013
Date of Patent
April 18, 2017
Patent Application Number
14103411
Patent Citations Received
US Patent 11715928 Decoupling layer to reduce underfill stress in semiconductor devices
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US Patent 11963291 Efficient wave guide transition between package and PCB using solder wall
0
Patent Inventor Names
Hou-Ju Huang
0
Szu-Wei Lu
0
Feng-Cheng Hsu
0
Jing-Cheng Lin
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9627346
Patent Primary Examiner
Andy Huynh
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