Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 25, 2017
Patent Application Number
14564231
Date Filed
December 9, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
An image sensor chip having a sidewall interconnect structure to bond and/or electrically couple the image sensor chip to a package substrate is provided. The image sensor chip includes a substrate supporting an integrated circuit (IC) configured to sense incident light. The sidewall interconnect structure is arranged along a sidewall of the substrate and electrically coupled with the IC. A method for manufacturing the image sensor chip and an image sensor package including the image sensor chip are also provided.
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