Patent attributes
A differential signal assembly includes two pairs of differential signal wafers arranged in one row. Each differential signal wafer includes a plurality of mating portions arranged in one column and a plurality of mounting portions arranged in one column. In one of the two pairs of differential signal wafers, each differential signal wafer has a grounding pin and an offset grounding pin respectively arranged at two opposite ends of the column of mounting portions thereof, each offset grounding pin has an offset with respect to the corresponding column of mounting portions, the two distal ends of the mounting portions of each differential signal wafer are two signal mounting portions, cooperating with the two signal mounting portions of the other differential signal wafer. Thus, the grounding pin and the offset grounding pin of each differential signal wafer are configured to shield the adjacent signal mounting portions.
