Create
Log in
Sign up
Golden has been acquired by ComplyAdvantage.
Read about it here ⟶
US Patent 9642259 Embedded bridge structure in a substrate
Overview
Structured Data
Issues
Contributors
Activity
Access by API
Access by API
Is a
Patent
Date Filed
October 30, 2013
Date of Patent
May 2, 2017
Patent Application Number
14067677
Patent Citations Received
US Patent 12002776 Interconnect structure and method for forming the same
0
US Patent 12087596 Controlling of height of high-density interconnection structure on substrate
0
Patent Inventor Names
Hong Bok We
0
Chin-Kwan Kim
0
Dong Wook Kim
0
Omar James Bchir
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9642259
Patent Primary Examiner
Andargie M Aychillhum
Find more entities like US Patent 9642259 Embedded bridge structure in a substrate
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Company
Home
Press & Media
Blog
Careers
WE'RE HIRING
Products
Knowledge Graph
Query Tool
Data Requests
Knowledge Storage
API
Pricing
Enterprise
ChatGPT Plugin
Legal
Terms of Service
Enterprise Terms of Service
Privacy Policy
Help
Help center
API Documentation
Contact Us
SUBSCRIBE