Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael Mesh0
Amir Geron0
Gideon Katz0
Jacob Hasharoni0
Yehoshua Benjamin0
Date of Patent
May 9, 2017
0Patent Application Number
135920160
Date Filed
August 22, 2012
0Patent Citations Received
0
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Patent Primary Examiner
Patent abstract
A method for assembling an optical interconnect apparatus is provided. The optical interconnect comprises an integrated circuit chip, and at least one optoelectronic chip positioned on the integrated circuit chip, each of the at least one optoelectronic chip including a 2-dimensional optoelectronic array. The optical interconnect further comprises a first and a second microlens array, a bundle of optical fibers coupled to each second microlens array and supported by a bundle housing, and a block structure supporting the bundle housing to a printed circuit board (PCB).
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