Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tingyu Lin0
Fengze Hou0
Date of Patent
May 16, 2017
0Patent Application Number
147034760
Date Filed
May 4, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A solution for dissipating heat generated from high power chip packages, e.g., a fcBGA package, wbBGA package, 2.5D/3D TSV package, PoP, etc. The heat dissipation system may include a high power chip package including a high power chip. A micro-jet may be attached to the high power chip. A micro-pump may be in fluidic communication with the micro-jet. A heat exchanger may be in fluidic communication with the micro-pump. The high power chip package is assembled on the same PCB with the micro-pump and the heat exchanger.
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