Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Caleb C. Han0
Tongbi T. Jiang0
Jun Zhai0
Date of Patent
May 23, 2017
Patent Application Number
15005908
Date Filed
January 25, 2016
Patent Citations Received
Patent Primary Examiner
Patent abstract
MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
