Patent attributes
Polyamide molding composition:(A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min;(B) 1-15 wt % of ethylene-vinyl acetate copolymer;(C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof;(D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A);(E) 0-20 wt % of flame retardant; and(F) 0-5 wt % of additives,wherein the sum total of components (A)-(F) is 100 weight percent.
