Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 13, 2017
Patent Application Number
14928144
Date Filed
October 30, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a low-adhesion film, a pair of substrates, and a metal electrode. The low-adhesion film has lower adhesion to metal than a semiconductor oxide film. The pair of substrates is provided with the low-adhesion film interposed therebetween. The metal electrode passes through the low-adhesion film and connects the pair of substrates, and includes, between the pair of substrates, a part thinner than parts embedded in the pair of substrates. A portion of the metal electrode embedded in one substrate is provided with a gap interposed between the portion and the low-adhesion film on the other substrate.
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