US Patent 9685356 Substrate support assembly having metal bonded protective layer
Patent 9685356 was granted and assigned to Applied Materials on June, 2017 by the United States Patent and Trademark Office.
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Patent abstract
A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer metal bonded to an upper surface of the ceramic body, wherein the protective layer is a bulk sintered ceramic article.
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US Patent 09685356 Substrate support assembly having metal bonded protective layer US Patent 9685356 Substrate support assembly having metal bonded protective layer
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Patent Number
0968535600
Patent Number
968535600
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
096853560
Date of Patent
June 20, 2017
0Patent Application Number
138420440
Date Filed
March 15, 2013
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
096853560
Date of Patent
June 20, 2017
0Patent Application Number
138420440
Date Filed
March 15, 2013
0Official Website
Patent Primary Examiner
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US Patent 09685356 Substrate support assembly having metal bonded protective layer
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
09685356
Date of patent
June 20, 2017
Patent application number
13842044
Date Filed
March 15, 2013
Patent primary examiner
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