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US Patent 9685394 Electronic device and manufacturing method therefor
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Patent
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Date Filed
May 13, 2011
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Date of Patent
June 20, 2017
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Patent Application Number
13106933
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Patent Citations Received
US Patent 12087629 Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon
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Patent Inventor Names
Shigenobu Sekine
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Yurina Sekine
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Yoshiharu Kuwana
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9685394
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Patent Primary Examiner
Ori Nadav
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