US Patent 9694959 Blister packaging components
Patent 9694959 was granted and assigned to Bemis Company, Inc. on July, 2017 by the United States Patent and Trademark Office.
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The present invention relates to blister components for blister packages formed from multilayer thermoplastic films. In one preferred embodiment of the present invention, the blister component has a layer sequence configuration of A/B/C/B/A. Preferably, layer A is a first exterior layer comprising cyclic olefin copolymer (COC), layer B is an interior layer comprising a high density polyethylene (HDPE), a blend of high density polyethylene, a high density polyethylene nucleation additive and optionally, a hydrocarbon resin (HDPE-Blend), or a bimodal high density polyethylene having a distribution of a low molecular weight region and a high molecular weight region (HDPE-Bimodal), or a high density polyethylene having a thickness of between 38.1 pm to 190.5 pm (1.5 mil to 7.5 mil), layer C is a central core layer. Alternatively, the blister component has a layer sequence configuration of A/B/C/B/D, where layer D is a second exterior layer.
US Patent 09694959 Blister packaging components US Patent 9694959 Blister packaging components
US Patent 09694959 Blister packaging components
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